Information about product failure based on chip manufacturing process contamination is given below. Let F denote the event that the product fails. Let H denote the event that the chip is exposed to high contamination during manufacture.
a) Find P(F∣H),P(H),P(F∩H).
b) Obtain P(F∣H′),P(H′),P(F∩H′). c) P(F).
